Teledyne Interconnect Devices (TID) is a fully-integrated supplier of highly reliable PCB stacking and compression spring interconnects, aerospace power transfer switches, underwater/geophysical interconnects, and thermal wire strippers. TID offers the industry both catalog and custom designed products to meet a variety of demanding applications. Teledyne Interconnect Devices provides high-density Surface Mount Technology (SMT), through hole, and PCB to PCB compression connectors, high density interposers for Land Grid Arrays (LGA), connectors for DMD/DLP® chips/Digital Micro-miror Devices (DMD), 5-100 amp aerospace power transfer switches, harsh environment interconnects, and thermal wire strippers. Located in Poway (San Diego area), California, Teledyne Interconnect Devices has provided innovative connectivity solutions since 1960.